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Samsung fires up production of second-gen 10-nm FinFET chips

30 November 2017

Qualcomm picked TSMC over Samsung for the Snapdragon 845 so the first 10nm LPP chips out of the factory will likely be Exynos models as well as chipsets like the Snapdragon 670 (10nm LPP). Also making headlines is the LPP or Low Power Plus technology, which will be incorporated into the newer chipsets.

Samsung announced today that its S3 manufacturing line in Hwaseong, Korea, has started fabrication of SoCs on 10LPP, the company's second-generation 10-nm FinFET process technology.

It will be very interesting to see how big of a difference can be translated in real-world scenarios but it also appears that Samsung is going to outfit both of these devices with the latest generation of UFS storage. At the very least, Samsung will be using them in the production of the Galaxy S9.

It is said that with 10LPP process brings up to 10% higher performance in 15% lower power consumption as compared to first-gen 10nm processors, which are used in Galaxy Note 8 and Galaxy S8 handsets. In addition to 10nm production, Samsung expects it will produce 7nm FinFET chips at S3 facility using Extreme Ultra Violet lithography when the process is ready. S3 is the third fab of Samsung's Foundry Business, following S1 in Giheung, Korea and S2 in Austin, USA.

Samsung is committed to improving its 10nm technology, continuing this trend with 8LPP, which is promised to be even more power efficient than the 10LPP process.

Although Samsung has not announced what kinds of devices will take advantage of this new SoC, it did state that devices with the chip would make an appearance early in 2018, with wider availability set for later in the year.

Samsung fires up production of second-gen 10-nm FinFET chips